http://ir-heat-ltd.com/en/tags/underfill/ Recent content in Underfill on Infrared Heat Limited Hugo en-us Mon, 01 Jun 2026 02:13:41 +0800 http://ir-heat-ltd.com/en/posts/underfill-curing-for-semiconductor-ir/ Mon, 01 Jun 2026 02:13:41 +0800 http://ir-heat-ltd.com/en/posts/underfill-curing-for-semiconductor-ir/ <p><img src="http://ir-heat-ltd.com/images/e619a459508a95cd74ea4eae0be40cd1.png" alt="Underfill curing for semiconductor IR"></p> <p>On the line, the clock doesn’t wait for thermal drift. In a 300 mm fab, underfill curing sits at the tail end—after bump, after flip-chip bonding—where throughput and yield are measured in seconds, and defects are measured in microns. Let the thermal profile drift and you’ll see voiding, fillet collapse, or CTE mismatch stress that shows up later as field failures. When the IR source underperforms, the oven stretches the dwell to compensate, and the line stops keeping pace. We built our semiconductor IR underfill curing around one hard requirement: process control that behaves like a spec, not a wish.</p>