Smart sensor packaging infrared
Cutting Carbon in Chip Packaging with Smart IR Making semiconductors is an energy hog. Period. If you look at the curing and drying stages of sensor...
2.5D/3D IC packaging heater
On the line, 2.5D/3D IC packaging doesn’t leave you any room to chase thermal drift. One hotspot during underfill cure, TIM die attach, or microbump...